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Page 1

C
ADVANCED
CIRCUITS
Leading the PCB Industry in Quality & Innovation
Maximum Useable Panel Area
For 12" x 18" Panel
For 18" x 24" Panel
For 18" x 27" Panel
For 18" x 32" Panel
For 18" x 36" Panel
For 18" x 42" Panel
For 18" x 54" Panel
For 21" x 24" Panel
For 21" x 60" Panel
10" x 16" ***
X
16.6" x 22" ***
X
16" x 25" *
16" x 30" *
16" x 34" *
16" x 40" *
16" x 52" *
19" x 22" **
18" x 58" *
For 24" x 30" Panel
22" x 28" *
* Up to 8 Layers / ** Up to 30 Layers / *** Up to 40 Layers
Special Products/Unique Capabilities
Heavy Copper
Heatsinks
Up to 20 oz.
Available
Backplates
Available
2 Layers up to 37" x 96" Panel w/ NPT's
Available
ROHACELL Foam Bonding
Available
Buried Chips and Resistors
Available
Resistance and Conductance Test Equipment
Available
Stack-Ups
Overall Thickness Range and Tolerances
Overall Board Thickness 0.010" - 0.250"
Overall Board Thickness Tolerances
< 0.020"
Standard +/- 0.004" Special +/- 0.003"
0.031"
Standard +/- 0.004" Special +/- 0.003"
Standard +/- 0.006"
0.062"
Special +/- 0.004"
Standard +/- 0.009"
0.093"
Special +/- 0.006"
Standard +/- 0.012"
0.125"
Special +/- 0.009"
0.187"
Standard +/- 0.018" Special +/- 0.014"
Standard +/- 0.025"
0.250"
Special +/- 0.018"
Thinnest Dielectric Finished
Thin Board Overall Thickness:
0.010" (2 Layer) 0.015" (4 Layer)
Thinnest Plated Core
0.004"
Advanced Circuits' Capabilities
Material
FR-4
Standard FR4
40 Layers
Isola FR406
40 Layers
Halogen Free
Isola Green Speed
40 Layers
Ventec VT-441, VT-447
40 Layers
RoHS
ITEQ IT-180A
30 Layers
30 Layers
Isola 185HR
Isola 370HR
40 Layers
Isola IS410 (CAF Resistant)
40 Layers
Isola FR408 and FR408HR
40 Layers
Isola I-TERA MT
Isola BT-IS620
Nelco BT-N5000
Nelco 4000-29
Nelco 4000-13 and 13SI
40 Layers
30 Layers
30 Layers
40 Layers
40 Layers
40 Layers
Nelco 4000-13EP and EPSI
Isola IS415 (CAF Resistant)
40 Layers
Polyimide
Cyanate Ester
40 Layers
20 Layers
RF Materials
Rogers 3000 Series
Max. 20 lyr. FR-4 w/ RO3000 Caps
Rogers 4000 Series (4003 and 4350)
20 Layers
8 Layers
Rogers 5870/5880
Taconic RF Materials
2 Layers
40 Layers
Isola Astra MT
Isola Tachyon
40 Layers
Advanced RF Materials
Nelco 9000 Series (PTFE)
2 Layers
4 Layers
Rogers 6000 Series
Rogers 5000 Series
Rogers Diclad 880, AD300A, CuClad, 250 & 233, CTLE
2 Layers
20 Layers
10 Layers
Arlon Genclad 280, LX250, GYN 2.17 Dk
Expanded Materials Used For Signal Integrity, Advanced HDI, and/or Stacked Microvias
Panasonic Megtron 6
Yes
Zeta Lam SE
3M ECM (Embedded Capacitance Material)
Yes
Yes
Yes (12 layer)
Yes
ROHACELL
Rogers 2929 Bondply
Arlon 6700 and 6250 Bondply
Yes
Page 2

Mechanical Capabilities
Machining Drill Capabilities
Primary Drilled Hole Location Tolerance to Datum Zero (DTP)
0.005"
2nd Drill Hole Location Tolerance to Datum Zero (DTP)
0.005"
Minimum Clearance from Copper Conductor to Mechanical Drilled Hole
0.006"
Minimum Clearance from Copper Conductor to a Laser
0.004"
Drilled Hole
Plated Through Hole Capabilities
Smallest Plated Through Hole Size with 0.001"
Minimum Average Copper Requirement
Finished Panel Thickness < 0.020"
0.003" Finished
Hole
Finished Panel Thickness 0.031"
0.003" Finished Hole
Finished Panel Thickness 0.062"
0.004" Finished Hole
Finished Panel Thickness 0.093"
0.008" Finished
Hole
Finished Panel Thickness 0.125"
0.010" Finished
Hole
Finished Panel Thickness 0.187"
0.012" Finished
Hole
0.018" Finished
Finished Panel Thickness 0.250" Hole (Excluding
HAL Finish)
+/- 0.003" Plated Hole Size Tolerance Standard;
Special +/- 0.002"
Plated Hole Size Press Fit Applications +/- 0.002" Typical
8:1 (0.007"
Aspect Ratio (with 0.010" Drill) Finish in 0.130"
Thick)
0.008"
0.006"
No Limit
+/- 0.005" Typical +/- 0.003" Special
0.010"
0.008"
0.02"
10:1
Conductive & Non-Conductive
100% U.S. Based Manufacturing
Plated Hole Spacing Minimum (Drilled Hole to Hole)
Non Plated Through Holes
Smallest Non-Plated Hole Size
Largest Non-Plated Hole Size Routed
Non-Plated Routed Hole Tolerance
Minimum NPTH to Edge of Board Spacing Blind/Buried Vias (Sequential Lamination)
Minimum FINISHED Via Hole Diameter - Epoxy Filled
Maximum FINISHED Via Hole Diameter - Epoxy Filled
Maximum Aspect Ratio for Epoxy Filled Via Holes
Available Epoxy Fill Types
HDI/Laser Microvia (µVia) Capabilities
Smallest (as ablated) Laser Via
Largest (as ablated) Laser Via
Via Aspect Ratio (Depth to Diameter)
Capture Pad Size
Landing Pad Size
Stacked Via
Type I Capabilities
Type II Capabilities
Type III Capabilities
Copper Filled Microvia
Control Depth / Drill Capabilities
Backdrill - PTH Stub Removal
Minimum Backside Dielectric Separation
Minimum Back Drill Diameter
Drill Depth Tolerance
Scoring Capabilities
Angles
Offset Tolerance
Optimum Remaining Web Thickness
Remaining Web Tolerance
True Position Tolerance
Edge Connector Bevel Capabilities
Bevel Depth Tolerance Profile Capabilities
Standard Router Bit Diameter
Routed Profile Tolerance
Minimum Internal Rout Radius
Minimum Routed PTH Slot Width
0.003"
0.010"
0.75:1 Standard
1:1 Advanced
��Via +0.008" Std ��Via +0.006" Adv
��Via +0.008" Std ��Via +0.006" Adv
Yes
Yes
Yes
Design Dependent
Yes
PTH+ 0.010"
Diameter
(Typical)
0.005"
0.014"
0.005" Typical, 0.004" Minimum
Standard 30�� Available 20��, 45��, & 60��
+/-0.005"
Typical Maximum 1/3 of thickness
+/-0.005"
+/-0.005"
Finger Tip Angle 15��, 20��, 30��, 45��
+/-0.005"
0.093", 0.062",
0.031" (Router Bits) Special
0.021"
+/-0.005" Standard +/-0.004" Special
0.015"
0.022" Typical
with 0.015"
Minimum
Page 3

Feature Size Capabilities
Internal Layer Capabilities
Minimum Conductor Width and Spacing
Internal Starting Copper Weight 1/2 oz.
0.00275" Line / 0.003" Space
Internal Starting Copper Weight 1 oz.
0.00375" Line / 0.0045" Space
Internal Starting Copper Weight 2 oz.
0.005" Line / 0.006" Space
Internal Starting Copper Weight 3 oz.
0.009" Line / 0.011" Space
Internal Starting Copper Weight 4 oz.
0.012" Line / 0.016" Space
External Layer Capabilities Minimum Conductor Width and Spacing
External Copper Finished Thickness 1.0 oz.
External Copper Finished Thickness 1.5 oz.
External Copper Finished Thickness 2.0 oz.
External Copper Finished Thickness 3.0 oz.
External Copper Finished Thickness 4.0 oz.
External Copper Finished Thickness 5.0 oz.
External Copper Finished Thickness 6.0 oz.
External Copper Finished Thickness 7.0 oz.
External Copper Finished Thickness 8.0 oz.
0.00275" Finished
0.004" Finished
0.005" Finished
0.009" Finished
0.011" Finished
0.020" Finished
0.030" Finished
0.045" Finished
0.060" Finished
Pad Diameter to Drilled Hole Size
IPC-6012
Class 2
Component Holes
Drilled Size Plus
0.010"
Via Holes
Drilled Size Plus
0.008"
Pad Diameter to Drilled Hole Size
IPC-6012
Class 3/3A
Component Holes
Drilled Size Plus
0.012"
Via Holes
Drilled Size Plus
0.010"
Pad Diameter to Laser Ablated Hole Size
Minimum
Drilled Size Plus
0.004"
Standard
Drilled Size Plus
0.008"
Military
Etch Back
Yes
IPC Class 3 Etchback Specification 0.0002"-0.002"
Solder Mask and Legend
Solder Mask
Min. LPI Solder Mask Clearance (Standard)
0.002" / Side (Pad Size + 0.004") 1:1 (Design Dependent)
Min. LPI Solder Mask Clearance (LDI Imaged)
0.005" / Side
Pad Size Larger than NPTH
(Pad Size +
0.010") 0.004" Preferred,
Web Between Surface Mount Pads 0.003 Minimum
(Green)
Green, Blue, Red,
Solder Mask Colors
Black, Yellow, White, Orange, Purple, Pink, Brown, Clear, Matte Green &
Matte Black
Liquid Photo Imageable
Laser Direct Imaging (Special)
Solder Mask Type
Min. Mask Defined Pad Diameter
0.005"
Yes
Solder Mask Plugged Vias
Legend
Printed Legend Minimum Stroke/Width
0.005"
LPI Legend Capability
Yes
LPI Legend Minimum Stroke/Width
0.002"
White, Black, Yellow, Red, Blue
Screened / LPI Legend Colors
Serialization / Unique Serialization
Yes
Surface Finish Options
Surface Finish Selection
Hot Air Solder Level (Lead Free, Lead Based)
Immersion Silver
Electroless Nickel Immersion Gold
Yes
Yes
OSP Yes (Outsource)
Yes
ENEPIG
Yes
Immersion Tin Yes (Outsource)
Full Body Gold
Yes
Bondable Gold Yes (Outsource)
Plated Nickel
Yes
Electroless Nickel
Yes
Copper
Yes
Yes
Hot Oil Reflow
Mixed Finishes
HASL with Selective Gold
Yes
Yes
Dual Gold Plating
Immersion Gold w/ Selective Hard Gold on Fingers
Yes
Recessed Fingers
Yes
Page 4

Via-in-Pad
Epoxy Filled Thru Hole Capability
Epoxy Filled Thru Hole Minimum
Epoxy Filled Thru Hole Maximum
Minimum Board Thickness
Maximum Board Thickness
Via Fill Aspect Ratio
Conductive VIP Options
Non-Conductive VIP Options
O
Data & Documentation
Tooling Formats
Film Data Formats
DXF, RS-274-x, RS-274-D, ODB++
ASCII, Excellon
Drill Data formats
Format; RS-274-X,
RS-274-D
Electrical Test Formats
IPC-D356
Netlist Compare Formats
IPC-D356
IPC-D356A
Tooling Communication
Compression Formats
ZIP, TAR, TGZ
Secure Data Transfer, PGP
The information provided in this sheet is subject to change without prior notice.
Secured Data Transfer Methods
C ADVANCED CIRCUITS
Tempe Division
229 S. Clark Drive Tempe, AZ 85281 Phone: (800)678-0233 Fax: (480)966-5896
Revised Feb. 2017
Yes
0.004" FHS
0.020" FHS
0.020"
0.125"
10:1
Yes
Yes
Testing Capabilities
Minimum Test Continuity Resistance
Maximum Test Voltage
.1 Ohms
1000 Volts
Maximum Test Isolated Resistance 25 Mohm-2Gohm
Largest Test - Fixtured
16" x 22"
27" x 24"
Largest Test - Flying Probe
Electrical Test Pitch (Fixture Test)
Electrical Test Pitch (Flying Probe Test)
0.020"
0.004"
DC Line Resistance Testing
Yes
Electrical Performance
Standard 10%,
TDR Test Tolerance (Print and Etch)
Advanced 5%
Standard 10%,
TDR Test Tolerance (Plated Copper)
Advanced 5%
TDR Test Tolerance Differential Measurements
Standard 10%, Advanced 5% Standard 10%, Advanced 5%
TDR Tolerance Single Ended Tolerance
HiPot Testing (AC & DC)
Yes
Quality Systems & Certifications
DOD Contracts | MIL-PRF-31032 | MIL-PRF-55110G AS9100C & ISO 9001:2008 Certified | JCP Registered IPC-6012 Class 2/3A Qualified | ITAR Registered
UL Certified
Leading the PCB Industry in Quality & Innovation
21303
Aurora Division Corporate Headquarters
21101 E. 32nd Pkwy Aurora, CO 80011 Phone: (800)979-4722 Fax: (888)224-3291
www.4PCB.com
Maple Grove Division
8860 Zachary Lane North Maple Grove, MN 55369 Phone: (763)424-3788 Fax: (763)425-0999
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